The design trend of printed circuit boards (PCB) for smaller features with very high densities is essential to support the rapidly growing market of high-tech products for the customer. This requires new laser processing capabilities with the use of PCB drilling machines.
The PCB drilling machines are a new generation of drilling, which makes use of the high power picosecond laser to allow high quality and higher production of blind holes in PC boards.
The PCB drilling machine uses a short pulse with high power density to quickly feed the energy in the workpiece, which causes the material to melt and vaporize. The greater the pulse energy, the more it melts and vaporizes the material. Vaporization will cause the volume of material in the punched hole to increase suddenly, creating a high pressure. This will cause the vapor pressure to eject the molten material from the orifice.
The PCB drilling machine must make through holes, and the blind holes must be drilled in the printed circuit board, which acts as interconnections between the layers systems. Both holes should have straight walls. Drilling by percussion with the use of UV laser is a method of choice for most PCB drills.
They achieve very high drilling rates of several thousand holes per second and can drill diameters up to 75 µm. The use of UV lasers allows drilling smaller diameters. However, these lasers are limited to only a few tens of watts of average power, which limits the speed of drilling.
Lasers have played an important role in the manufacture of PCBs and have improved PCBA manufacturing processes. A precise and stress-free PCB processing solution, UV laser cutting is especially suitable for the desquared as it completely eliminates mechanical stress.